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Slurry parameters effect on Chemical-Mechanical Planarisation (CMP) of deposited silver (Ag) on chip
  • ISSN号：1749-785X
  • 期刊名称：International Journal of Surface Science and Engin
  • 时间：0
  • 页码：237-249
  • 语言：英文
  • 相关项目：化学机械组合作用功能粒子及其超精抛光机理研究
作者： Du, H.|Pei, H. F.|Dai, Y. J.|Sun, J. Z.|Liu, Y.|Pan, G. S.|
同期刊论文项目
化学机械组合作用功能粒子及其超精抛光机理研究
期刊论文 17 会议论文 9 获奖 2 专利 11
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