中文摘要：

将超声波联接技术应用于聚合物微器件的联接,搭建了超声波精密联接系统。为了保证微器件在精密联接中的形状精度,选用工作频率为60 kHz的超声换能器及驱动电源为微器件提供高频、低振幅的超声波振动;以高细分步进电机驱动直线导轨控制超声波工具头的纵向移动,精确控制超声波工具头的位置,并结合力传感器实现了超声波联接过程中聚合物材料力学性能的实时检测。针对联接表面特性差异引起的联接质量不一致问题,提出了基于材料力学性能反馈的压力自适应联接方法,可以对不同零件提供自适应的超声波能量。应用该系统对PMMA材料微器件进行了联接实验,实验结果表明,该方法大幅提高了超声波联接的稳定性,实现了聚合物微器件的超声波精密联接。

英文摘要：

Ultrasonic bonding was presented to bond the polymer micro devices in this paper.An ultrasonic precise bonding device was established and an adaptive pressure control method was also proposed.Considering the accuracies of shape and position of joining,a 60 kHz ultrasonic energy converter and a driving source were chosen to provide the higher frequency and lower amplitude for the micro device to reduce the damage of micro structure in bonding.Then,a high resolution stepper motor and a linear guide were chosen to control the longitudinal movement,and positioning accuracy of ultrasonic horn and to realize the real-time monitoring of the mechanical behaviors of polymer materials during bonding.Aiming at the problem of instable joining quality from the difference of surface roughness,an adaptive pressure control method based on material mechanical behavior feedback was proposed.Experiment results show that the stability of bonding is improved obviously by this bonding method and the precision bonding is achieved.