采用电化学方法制备了溶液中稳定的Au隧道结,对制备过程中量子线到隧道结的整个实验过程进行了研究。结果表明,由于存在机械应力,直接腐蚀Au丝很难精细控制电化学过程,导致无法直接制得隧道结。通过向溶液中加入氯金酸进一步电化学沉积/腐蚀成功地解决了此问题,但溶液中Au离子的自沉积作用导致所形成的隧道结不稳定。针对这一问题,对实验过程进行了改进,采用将腐蚀直接制得的电极对在盐酸溶液中定向电沉积的办法制备得到了溶液中稳定的Au隧道结。
A stable Au tunnel junction was fabricated electrochemically with the thin gold wire and the process was investigated in details. It is found that Au tunnel junction is not easy to be obtained by direct elec-trochemical etching of Au wire due to the mechanical stress. However, it's easy to control the process of elec-trochemical deposition on a preformed Au electrode pair as well as its reverse process-etching with addition of chloiroauric acid in solution. The existence of Au ions may cause somewhat instability of the junction, while in hydrochloric acid solution, the process is under control and the Au tunnel junction is stable.