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Statistical lifetime reliability optimization considering joint effect of process variation and agin
  • 期刊名称：Integration, the VLSI Journal
  • 时间：2011
  • 页码：185-191
  • 相关项目：三维芯片中硅直通孔和晶片电路的测试技术研究
作者： Song Jin|Yinhe Han*|Huawei Li|Xiaowei Li|
同期刊论文项目
三维芯片中硅直通孔和晶片电路的测试技术研究
期刊论文 13 会议论文 13 专利 3
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