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MicroFix: Using Timing Interpolation and Delay Sensors for Power Reduction
  • 期刊名称：ACM Transactions on Design Automation of Electroni
  • 时间：2011
  • 页码：1-21
  • 相关项目：三维芯片中硅直通孔和晶片电路的测试技术研究
作者： Guihai Yan|Yinhe Han*|Hui Liu|Xiaoyao Liang|Xiaowei Li|
同期刊论文项目
三维芯片中硅直通孔和晶片电路的测试技术研究
期刊论文 13 会议论文 13 专利 3
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