中文摘要：

利用电触头电阻钎焊有限元分析模型，分别对下电极与铜基体的接触方式及不同焊接电流下铜基体，在容易产生氢脆和软化的高温区域的停留时间进行优化对比，得到中心区域温度高于四周的温度场分布，以利于液态钎料填缝时焊渣及气体的排除，从而提高接头质量，通过优化加热方式降低铜基体所受影响，最终得到更加合理的电触头电阻钎焊工艺。

英文摘要：

A optimal process of electrical con- tact with resistance brazing is comfirmed by the finite element model, which is used to optimize the different contact types of down electrodes and the copper substrate,which is used to optimize the residence time of softening of the high temperature area of the copper substrate on different welding current. By optimizing,we get the center area temperature higher than the temperature field distribution, which be easy for the liquid solder welding slag and gas purging caulking. Finally, we get the more reasonable resistance brazing process by optimizing heating mode to reduce the affection of the copper substrate.