中文摘要：

提出一种模拟层叠封装制造全过程的有限元方法，用于评估芯片应力和翘曲变形情况，为层叠封装设计和提高成品率提供工具．建立了层叠封装3维有限元模型，考虑了温度对材料属性和模塑化合物收缩的影响，并采用单元生死技术实现了各工艺步间的无缝连接，分析了封装在加工工艺过程中的应力分布以及翘曲的连续演化情况。结果表明，给出的方法可行有效。

英文摘要：

Package on package （POP） is a widely used 3D packaging technology. In this paper, a finite element approach is proposed to simulate the entire assembly process of a PoP component through the techniques of element die and birth as well as restart in ABAQUS, and the approach is applicable to transfer stress and warpage in one process to the next so that the evolution of stresses and warpages during assembly can be predicted. Simulation results show that the approach is feasible and effective.