中文摘要：

本文基于E-G修正指数对中国集成电路产业集聚程度进行测定,从产业整体集聚程度和分行业产业集聚程度两个方面对中国集成电路产业发展态势进行分析,同时深入观察中国集成电路产业集聚地区分布变化以及区域产业转移的特点。研究结果表明：中国集成电路产业整体集聚程度处于较高状态,但呈现出逐年下降的发展态势。不同分行业中制造业、封测业、设计业集聚程度呈现较大幅度下降趋势,装备业集聚程度呈现小幅度上升趋势,材料业集聚程度基本保持稳定。整个集成电路产业区域分布集中在长三角地区、京津环渤海地区以及珠三角地区,且制造业、封测业呈现向中西部地区转移的发展态势,为中国集成电路产业区域发展规划与政策的制定提供决策依据。

英文摘要：

The paper judged China＇s IC industrial agglomeration degree through modified E - G Index, and analyzed China＇s IC industry development trend from the whole and the subdivided industrial agglomeration degree, and observed the regional layout and industrial relocation of China＇s IC industry. The results showed that： China＇s integrated circuit industry as a whole cluster is in high state, but present a decline situation of recent development. In the subdivided industry, the manufacturing, packaging and test industry, design had a sharp decline, the equipment had a small increments rising, and the material remained basic stable state. The regional distribution of China＇s IC industry was concentrated in the Yangtze river delta, Beijingtianjin Bohai sea area and the Pearl river delta region, but the manufacturing, packaging and test industry had began to transfer to the central - western regions. All of these conclusions can provide decision- making basis for China＇s IC industry regional development planning and policy- making.