首先介绍了光刻技术的发展及其面临的挑战。随着纳米加工技术的发展,纳米结构器件必将成为未来集成电路的基础,而纳米光刻技术是纳米结构制作的基础,基于表面等离子体的纳米光刻作为一种新兴技术有望突破45nm节点从而极大提高光刻的分辨力。介绍了表面等离子体的特性,对表面等离子体(SPs)在光刻中的应用作了回顾和分析,指出在现有的利用表面等离子体进行纳米光刻的实验装置中,或采用单层膜的超透镜(Superlens),或采用多层膜的Super-lens,但都面临着如何克服近场光刻这一难题;结合作者现有课题分析了表面等离子体光刻的发展方向,认为结合多层膜的远场纳米光刻方法是表面等离子体光刻的发展方向。
The development and challenge of optical lithography are firstly development of nanotechnology, nano-scale devices will be the fundament of IC, introduced. With the while nanolithography is the basic technology of micro- or nano-fabrieation. Nanolithography based on surface plasmons is the alternative of the next generation lithography which can breakthrough 45 nm node and improve the resolution considerably. Then, the particular properties of surface plasmons are introduced and its application for lithography is reviewed and analyzed. Most of the nanolithography technologies based on surface plasmons use single-layered superlens or multi-layered superlens, but none of them can overcome the difficulty of near-field. Combined with the authors' research, the promising applications of surface plasmons in lithography are pointed out. The analysis shows that far-field nanolithography with multi-layered superlens will take an important role in IC fabrication.