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用概率设计方法对无铅倒装焊封装芯片的参数研究
  • 所属机构名称：桂林电子科技大学
  • 语言：英文
  • 成果类型：会议
  • 相关项目：微电子封装用高聚物的热－机械疲劳损伤研究
作者： 梁军生|杨道国|李泉永|G. Q. Zhang|
同会议论文项目
微电子封装用高聚物的热－机械疲劳损伤研究
期刊论文 14 会议论文 12
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