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Study on the Crack Propagation Mechanism of Packaging Polymers by a Combinational Approach of Fractu
  • 所属机构名称：桂林电子科技大学
  • 会议名称：Proceedings of International Conference on Fracture and Damage of Advanced Materials,
  • 语言：英文
  • 成果类型：会议
  • 相关项目：微电子封装用高聚物的热－机械疲劳损伤研究
作者： Y.B. Gong|Q.Y. Li|D.G. Yang|S. Wu (龚雨兵|李泉永|杨道国|梁军生)|
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微电子封装用高聚物的热－机械疲劳损伤研究
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