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Warpage-Based Optimization Of The Curing Profile For Electronic Packaging Polymers
  • 所属机构名称：桂林电子科技大学
  • 会议名称：Proceedings of the Fifth International Conference on Electronic Packaging Technology
  • 语言：英文
  • 成果类型：会议
  • 相关项目：微电子封装用高聚物的热－机械疲劳损伤研究
作者： D.G. Yang|K.M.B. Jansen|Q.Y. Li|J.S. Liang|L.J. Ernst|G. Q. Zhang (杨道国等)|
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微电子封装用高聚物的热－机械疲劳损伤研究
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