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Analysis of thermal-moisture induced failure of Pb-free soldered IC packages in SMT reflow soldering
  • 所属机构名称：桂林电子科技大学
  • 会议名称：Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments
  • 语言：英文
  • 成果类型：会议
  • 相关项目：微电子封装用高聚物的热－机械疲劳损伤研究
作者： Sun-Ning|Lin-Dachuan|Yang-Daoguo|
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微电子封装用高聚物的热－机械疲劳损伤研究
期刊论文 14 会议论文 12
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