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Study on Simulation-based Optimization for Flip Chip Package Parameters by Using RSM Analysis and An
  • 所属机构名称：桂林电子科技大学
  • 会议名称：Proceedings of the Fifth International Conference on Electronic Packaging Technology
  • 语言：英文
  • 成果类型：会议
  • 相关项目：微电子封装用高聚物的热－机械疲劳损伤研究
作者： Quanyong Li|Yubing Gong|Daoguo Yang|Junsheng Liang (李泉永|龚雨兵|杨道国|梁军生)|
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微电子封装用高聚物的热－机械疲劳损伤研究
期刊论文 14 会议论文 12
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