Interconnect Capacitance Characterization based on Charge Based Capacitance Measurement (CBCM) Techn
- 所属机构名称:北京大学
- 会议名称:9th International Conference on Solid-State and Integrated-Circuit Technology
- 成果类型:会议
- 会场:Beijing, PEOPLES R CHINA
- 相关项目:纳米工艺下可制造性和成品率驱动的集成电路设计方法学研究