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Plasma Enhanced Atomic Layer Deposition ofCopper Thin Film using [Cu(iPr-amd)]2 as Precursor
  • 所属机构名称：北京印刷学院
  • 会议名称：The 10th Asian-European International Conference on Plasma Surface Engineering (AEPSE2015)
  • 时间：2015.9.24
  • 成果类型：会议
  • 相关项目：磁场辅助等离子体增强原子层沉积技术中的物理问题研究
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磁场辅助等离子体增强原子层沉积技术中的物理问题研究
期刊论文 45 会议论文 24
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