中文摘要：

目前LED封装过程中由于缺乏有效的检测方法，导致产品的次品率较高。本文根据pn结的光生伏特效应，提出了一种针对LED封装半成品的非接触在线检测方法。该方法通过测量pn结光生伏特效应在引线支架中产生的光生短路电流，分析LED芯片功能状态及芯片与引线支架间的电气连接情况。在检测短路电流时，根据LED封装支架结构，采用互感原理实现非接触测量，克服了接触式测量的缺陷，提高了检测精度。研究表明，对红、黄、绿等各种颜色的LED，该方法都能快速有效地完成在线检测。

英文摘要：

There is a lack of online test method for light-emitting diode （LED）chip during packaging process. An online non-contact fault detection method for LED chip in packaging is presented based on the photovoltaic effect in diode. By observing the current in the bonding lead frame of LED chip, which is induced by illuminating the chip, the LED chip function and its electric connection with the lead frame during packaging are detected. According to the structure of the LED lead frame, a method based on mutual induction is used to measure the photo-generated current without any contact with the LED chip. Experimental results show that LEDs with various colors could be detected online quickly and effectively.