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采用光生伏特效应的LED芯片在线检测方法研究
  • 期刊名称:仪器仪表学报,2009,30(3):454-458 (EI号: 20091812064074)
  • 时间:0
  • 分类:TN312.8[电子电信—物理电子学]
  • 作者机构:[1]重庆大学光电工程学院光电技术及系统教育部重点实验室,重庆400044
  • 相关基金:国家自然科学基金(No.60676031)、重庆市科技攻关重大项目资助
  • 相关项目:采用光激励和光检测的LED芯片非接触检测技术
中文摘要:

基于pn结的光生伏特效应,本文研究了一种非接触式LED芯片在线检测方法。通过测量pn结光生伏特效应在引线支架中产生的光生电流,检测LED封装过程中芯片质量及芯片与支架之间的电气连接状态。通过分析pn结光生伏特效应的等效电路,详细论述了半导体材料的各种参数及等效电路中各电参数与支架上流过的光生电流的关系。实验对各种不同颜色的LED样品进行了测量。研究表明,该方法可以实现LED芯片的在线检测,有较大的应用价值。

英文摘要:

A non-contact method based on the photovohaic effect in pn junctions is studied. The function of the LED chip and its connection status with the lead frame during packaging process are detected by measuring the photo-generated current across the lead frame. The equivalent circuit of photovohaic effect is analyzed, and the relationship between the parameters of LED and the photo-generated current in the lead frame is described in detail. LEDs with various colors are tested in experiments, and the experimental results show that the method could be used for online detecting of LED chips in packaging.

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