中文摘要：

对于封装过程中的LED芯片的检测目前还没有行之有效的方法,基于p-n结的光生伏特效应和法拉第定律,提出一种非接触式的针对LED封装过程中芯片质量及芯片与支架之间连接状态的检测方法。根据实际LED芯片所处的闭合短路状态,感应回路由绕在高磁导率条形磁芯上的多匝线圈构成。磁芯采用不同搭接方式以提高检测的信噪比,根据实验结果确定了磁芯的最佳搭接方式。实验结果表明,该方法具有较高的检测精度,可以实现对闭合短路状态微安量级光生电流的检测。计算结果与实验结果吻合较好。

英文摘要：

Online test methods for LED chips during packaging process are not available at present. A noncontact technique based on the photovoltaic effect in p-n junctions and Faraday＇s law is presented, which is applied for detecting chips function and connection status between chips and lead frame during packaging process of LED chips. According to the closed circuit status of LED chips, induced circuit is composed of multi-circuit coil with high-permeability bar magnetic core. Different lapped ways of magnetic core are used to improve signal-to-noise ratio, optimal lapped way is determined according to the result of experiments. The experimental results show that the technique has a high detecting accuracy, and it can realize detecting for closed loop circuit photocurrent, which is just at micro-ampere magnitude. The calculation results are well consistent with the experimental results.