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Effects of high-temperature treatment on the reaction between Sn-3%Ag-0.5%Cu solder and sputtered Ni
  • ISSN号：0361-5235
  • 期刊名称：Journal of Electronic Materials
  • 时间：2012.10.1
  • 页码：3145-3151
  • 相关项目：基于FBAR的紫外和红外光传感器的研究
作者： 董树荣|王曦|周剑|王德苗|
同期刊论文项目
基于FBAR的紫外和红外光传感器的研究
期刊论文 36 会议论文 1
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