微机电系统(MEMS)工艺已被广泛用于制造各种硅基薄膜器件。声表面波(SAW)器件是性能优良的MEMS器件。该文利用多物理耦合场软件COMSOLMultiphysics仿真了氧化锌/硅(ZnO/Si)结构SAW谐振器,并得到其S11参数。对应于仿真,该文制造了该种结构的SAW器件。实验所用的ZnO通过射频磁控溅射制备,所制备的ZnO具有良好的(002)取向。实验测得的ZnO/Si结构SAW器件的中心频率为111.6MHz,与仿真结构接近。
MEMS process has been widely used to manufacture a variety of silicon-based thin film devices. Surface acoustic wave(SAW) device is a kind of MEMS devices with excellent properties. In this paper, The ZnO/Si based SAW devices were simulated by COMSOL Multiphysics and the S11 parameters were obtained. According to the simulation results, we manufactured the ZnO/Si based SAW devices. ZnO thin film with good (002) orientation was deposited by radio frequeney(RF)-magnetron-sputtered. The ZnO/Si based SAW device with center frequency of 111.6 MHz has been obtained and the result is close to that obtained by the simulation structure.