论述了多孔硅的特点和制备方法,简单介绍双槽电化学腐蚀法的特点,并采用双槽电化学腐蚀法成功制备了多孔硅。多孔硅的扫描电镜(SEM)照片表明.孔径尺寸小.均匀性好,腐蚀结构规则。实验结果表明,衬底导电类型影响着多孔硅的制备条件。
The characteristic and preparing of porous silicon were discussed. The porous silicon was successfully prepared by double-cell electrochernical etching. The SEM photos of porous silicon prepared by double-cell electrochernical etching were observed. The results show that the porous silicon obtained by this method has the smaller hole diameter , good uniformity, ordered etching structure. The type of substrate affect the condition of the porous silicon preparation.