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Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste
  • ISSN号：0361-5235
  • 期刊名称：Journal of Electronic Materials
  • 时间：2012.9.9
  • 页码：2543-2552
  • 相关项目：大功率半导体激光器芯片连接热循环和电脉冲疲劳失效机理
作者： Wang, Tao|Zhao, Meihua|Chen, Xu|Lu, Guo-Quan|Ngo, Khai|Luo, Shufang|
同期刊论文项目
大功率半导体激光器芯片连接热循环和电脉冲疲劳失效机理
期刊论文 14 会议论文 5
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