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Rapid Sintering Nanosilver Joint by Pulse Current for Power Electronics Packaging
ISSN号:1530-4388
期刊名称:IEEE Transactions on Device and Materials Reliabil
时间:2013.3.3
页码:258-265
相关项目:大功率半导体激光器芯片连接热循环和电脉冲疲劳失效机理
作者:
Mei, Yunhui|Cao, Yunjiao|Chen, Gang|Li, Xin|Lu, Guo-Quan|Chen, Xu|
同期刊论文项目
大功率半导体激光器芯片连接热循环和电脉冲疲劳失效机理
期刊论文 14
会议论文 5
同项目期刊论文
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Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 5 x 5-mm(2) Chip Attachment
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Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandw
Creep properties of low-temperature sintered nano-silver lap shear joints
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Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packa
Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver past
High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films