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Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 5 x 5-mm(2) Chip Attachment
  • ISSN号：2156-3950
  • 期刊名称：IEEE Transactions on Components Packaging and Manu
  • 时间：2012.11.11
  • 页码：1759-1767
  • 相关项目：大功率半导体激光器芯片连接热循环和电脉冲疲劳失效机理
作者： Chen, Gang|Cao, Yunjiao|Mei, Yunhui|Han, Dan|Lu, Guo-Quan|Chen, Xu|
同期刊论文项目
大功率半导体激光器芯片连接热循环和电脉冲疲劳失效机理
期刊论文 14 会议论文 5
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