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Effect of Solder Volume on Shear Strength of Sn-3.0Ag-0.5Cu Solder and Cu Metallization
  • 期刊名称：Journal of Shanghai Jiaotong University (Science)
  • 时间：0
  • 页码：149-152
  • 语言：中文
  • 相关项目：含有限晶粒的电子封装微连接接头的微观力学行为
作者： Pengrong Lin|Yanhong Tian|Le Liang|Qian Wang|Chunqing Wang|Shihua Yang|
同期刊论文项目
含有限晶粒的电子封装微连接接头的微观力学行为
期刊论文 8 会议论文 7 专利 1
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