位置：成果数据库 > 期刊 > 期刊详情页
Barrierless Cu-Ni-Nb thin films on silicon with high thermal stability and low electrical resistivit
  • ISSN号：0884-2914
  • 期刊名称：Journal of Materials Research
  • 时间：2014.2.28
  • 页码：605-605
  • 相关项目：多元稳定固溶体的团簇加连接原子结构模型及其在Cu合金设计中的应用
作者： Liu, Li Jun|Bao, Cui Min|Chu, Jinn P.|Dong, Chuang|
同期刊论文项目
多元稳定固溶体的团簇加连接原子结构模型及其在Cu合金设计中的应用
期刊论文 27
同项目期刊论文
Laser cladding of Fe-B-Si iron base amorphous composite materials on 45 steel surface
Barrierless Cu-Ni-Mo Interconnect Films with High Thermal Stability Against Silicide Formation
Barrierless Cu–Ni–Nb thin films on silicon with high thermal ability and low ele
多组元合金成分设计方法
Nearest-neighbor coordination polyhedral clusters in metallic phases defined using Friedel oscillati
β Zr-Nb-Ti-Mo-Sn alloys with low Young's modulus and low magnetic susceptibility optimized via
Thermal stability of barrierless Cu-Ni-Sn films
First-principles calculations of elastic moduli of Ti–Mo–Nb alloys using a cluster-plus-glue-atom mo
Electrical resistivity interpretation of ternary Cu–Ni–Mo alloys using a cluster-based short-range-o
First-principle study of the structural, electronic, and magnetic properties of amorphous FeB alloys
Solute/impurity diffusivities in bcc Fe: A first-principles study
Composition design of superhigh strength maraging stainless steels using a cluster model
Carbon-doped Cu films with self-forming passivation layer
Understanding the Cu-Zn brass alloys using a short-range-order cluster model: significance of specif
Application of cluster-plus-glue-atom model to barrierless Cu-Ni-Ti and Cu-Ni-Ta films
Composition formulas of Cu-Ni industrial alloy specifications
溶质元素(Ni,Sn)总量对Cu-Ni-Sn合金导电性能的影响
Cluster-plus-glue-atom model and universal composition formulas [cluster](glue atom)(x) for BCC soli
Ab initio molecular dynamics simulation of binary Ni62.5Nb37.5 bulk metallic glass: validation of th
面心立方固溶体合金的团簇加连接原子几何模型及典型工业合金成分解析