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Carbon-doped Cu films with self-forming passivation layer
  • ISSN号：0257-8972
  • 期刊名称：Surface and Coatings Technology
  • 时间：2014.4.15
  • 页码：9-14
  • 相关项目：多元稳定固溶体的团簇加连接原子结构模型及其在Cu合金设计中的应用
作者： Xu, L. Y.|Bao, C. M.|Chu, J. P.|Dong, C.|
同期刊论文项目
多元稳定固溶体的团簇加连接原子结构模型及其在Cu合金设计中的应用
期刊论文 27
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