中文摘要：

为提升Cu-Ni-Sn合金的导电率,系统研究了溶质元素（Ni,Sn）含量对导电Cu合金导电率和硬度的影响.通过对现有典型牌号Cu合金进行成分解析,发现在Ni、Sn原子比为3/1时合金具有高的导电率和强度,故本工作固定Ni、Sn原子比为3,改变Ni和Sn总量,设计了一系列三元成分合金;采用真空电弧熔炼工艺制备合金锭,随后进行1093 K/1 h固溶＋65％～75％变形冷轧＋673K/2 h时效处理.实验结果表明,经过固溶＋变形＋时效处理后的Cu合金的导电率随溶质元素（Ni＋Sn）含量增加而降低,而硬度变化则呈相反趋势;系列Cu合金的弹性模量随（Ni＋Sn）含量基本保持不变.由此,为使Cu合金的导电率不低于15.0％ IACS、且保持一定的强度,溶质元素（Ni＋Sn）含量应为10.0％≤y（Ni＋Sn）≤16.0％（质量百分比含量为12.0％≤w（Ni＋Sn）≤18.0％）.

英文摘要：

The present work investigated the influences of the amounts of solute elements Ni and Sn on the electric conductivity and Vickers hardness of Cu-Ni-Sn ternary alloys for improving conductivities further. The compo- sitions of typical Cu-Ni-Sn alloy brands were analyzed and it was found that Cu alloys with Ni/Sn ratio was 3 had rela- tively high conductivities and high strengths. Thus, a series of （Cu-Ni-Sn alloys were designed by fixing Ni/Sn ratio but changing（Ni-＋-Sn） amounts. These alloy ingots were prepared by vacuum arc melting method, homogenized at 1093 K for 1 h, followed by 650/oo--75% cold rolling deformation, and then aged at 673 K for 2 h. The experimental results show that conductivities of the aged alloy series decrease with the total amount of （Ni＋Sn） increasing, while their Vickers hardness exhibits an opposite tendency. The Young＇s moduli of these Cu alloys are generally inflexible as （Ni-＋- Sn） varies. The aggregate amount of （Ni＋ Sn） to guarantee alloys with a conductivity not less than 15 % IACS and a relatively high strength should be in the range of 10. 0 at%y（Ni＋Sn）≤16.0 at% （12.0 wt≤w（Ni＋Sn）≤ 18. 0 wt%）.