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Barrierless Cu–Ni–Nb thin films on silicon with high thermal ability and low ele
  • 期刊名称：Journal of Materials Research
  • 时间：2013.12.28
  • 页码：3367-3372
  • 相关项目：多元稳定固溶体的团簇加连接原子结构模型及其在Cu合金设计中的应用
作者： Li Jun Liu|Cui Min Bao|Jinn P. Chu|Chuang Dong|
同期刊论文项目
多元稳定固溶体的团簇加连接原子结构模型及其在Cu合金设计中的应用
期刊论文 27
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