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Application of cluster-plus-glue-atom model to barrierless Cu-Ni-Ti and Cu-Ni-Ta films
  • ISSN号：1553-1813
  • 期刊名称：Journal of Vacuum Science and Technology A
  • 时间：2014.11
  • 页码：-
  • 相关项目：多元稳定固溶体的团簇加连接原子结构模型及其在Cu合金设计中的应用
作者： Ding, Jianxin|Wang, Miao|Chu, Jinn P.|Dong, Chuang|
同期刊论文项目
多元稳定固溶体的团簇加连接原子结构模型及其在Cu合金设计中的应用
期刊论文 27
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