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Barrierless Cu-Ni-Mo Interconnect Films with High Thermal Stability Against Silicide Formation
  • ISSN号：0361-5235
  • 期刊名称：Journal of Electronic Materials
  • 时间：2012.12
  • 页码：3447-3452
  • 相关项目：多元稳定固溶体的团簇加连接原子结构模型及其在Cu合金设计中的应用
作者： Zhang, X. Y.|Chu, J. P.|Wang, Q.|Dong, C.|
同期刊论文项目
多元稳定固溶体的团簇加连接原子结构模型及其在Cu合金设计中的应用
期刊论文 27
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