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Study on Contact Forms in Wafer Chemical Mechanical Polishing in Nanomachining
  • 期刊名称：American Journal of Nanotechnology
  • 时间：2010.2.2
  • 页码：56-61
  • 相关项目：耦合能量超精密加工SiC单晶基片的机理与工艺研究
作者： Su Jianxiu, Du Jiaxi,Chen xiqu|
同期刊论文项目
耦合能量超精密加工SiC单晶基片的机理与工艺研究
期刊论文 17 专利 3
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硅片加工表面层损伤检测技术的试验研究
Material removal rate of 6H-SiC crystal substrate CMP using an aluminaAl2O3 abrasive