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Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior
  • ISSN号：0255-5476
  • 期刊名称：Materials Science Forum
  • 时间：2012.11.11
  • 页码：313-317
  • 相关项目：耦合能量超精密加工SiC单晶基片的机理与工艺研究
作者： Zhang Shengfang|Su Jianxiu|Du Jiaxi|
同期刊论文项目
耦合能量超精密加工SiC单晶基片的机理与工艺研究
期刊论文 17 专利 3
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