采用等离子体增强型化学气相沉积(PECVD)法在晶体硅太阳电池表面镀上一层氮化硅减反射膜,通过数值分析和实验研究的方法讨论了压强、SiH4/NH3比、总气体流量及时间等工艺参数对镀膜速率、折射率和镀膜均匀性及钝化效果的影响。在温度为450℃、NH3/SH4=8:1、总气体流量为4320sccm、压力为170Pa、沉积时间为720s的条件下生长出平均膜厚为75nm、折射率为2.05、少子寿命相对较高的氮化硅膜,且应用于单晶整舟为168片的管式PECVD设备,片间膜厚级差在5nm以内,而折射率级差在0.3以内,少子寿命可提高约30%。
Antireflection from of silicon nitride (SiNx) was deposited for crystalline silicon solar cells by means of plasma enhanced chemical vapor deposition (PECVI)). The effect of the pressure, ratio of SiH4/NH3, the gas flow, temperature and deposition time were investigated . The deposition rate, refractive index, film uniformity and minority cartier lifetime were realized. The optimized film of 75nm SiNx with reflection index of 2.05 was obtained in the production line.