中文摘要：

分析了照明用大功率LED封装的散热特性，提出了一种用于大功率LED系统散热的回路热管；研究了热负荷、倾角、加热方式等对热管的起动性、均温性、热阻等的影响。试验结果表明，所设计的热管散热器的热阻在0．19K／W～3．1K／W之间，蒸发器的均温性被控制在1．5℃以内，满足大功率LED封装的均温性要求，在热负荷为100W时，蒸发器的温度被控制在100％以下，满足大功率LED结点温度的控制要求。

英文摘要：

The heat - release characteristics of high power LED package applied to lighting were analyzed and a novel flat evaporator loop heat pipe cooling device for high power LED was developed;The influences of heat loads, inclining angles and heating ways on the startup performance, temperature uniformity and thermal resistance of loop heat pipe were studied experimentally. The results indicate that the thermal resistance of the heat pipe heat sink is in the range of 0.19K/W - 3.1K/W, the temperature uniformity in the evaporator is controlled within 1.5K, and the junction temperature of high power LED can be controlled steadily under 100℃ for the heat load of 100W. The loop heat pipe studied in this paper can effectively meet the requirement of the thermal management of high power LED, and shall be very promising heat - transfer devices for controlling junction temperature Of high power LED system.