中文摘要：

摘要：通过座滴法研究了Sn—In、Sn—Bi和Sn—Ag—Cu三种焊料分别与块状非晶合金Zr44Cu40Al8Ag8的润湿行为。结果显示在三种焊料中，Sn—In对块状非晶合金Zr44Cu40Al8Ag8的润湿性最好，而Sn—Bi焊料对块状非晶合金Zr44Cu40Al8Ag8的润湿性最差。利用扫描电镜研究了Sn—In焊料与块状非晶合金Zr44Cu40Al8Ag8的界面特征，其界面处有化合物出现。

英文摘要：

During the joint of metallic glass, the most serious issue is the reformation of glassy phase at the high temperature area. To avoid the recrystallization of glassy phase, the soldering process has been investigated to join metallic glasses. The sessile drop method was used to study the wetting behavior and interracial characteristics of lead-free solders （Sn-In, Sn-Bi and Sn-Ag-Cu） on Zr44Cu40 Al8Ag8 metallic glass substrate in high vacuum. Results show that the Sn-In solder on Zr44 Cu40 Al8Ag8 metallic glass had better wetting characteristics than the Sn-Bi and Sn-Ag-Cu solders. Wettability of Sn-Bi solder on Zr44Cu40Al8Ag8 metallic glass was the worst in three lead-flee solders. The microstructure at the interface between Sn-In solder and Zr44 Cu40 Al8Ag8 metallic glass was analyzed by scanning electron microscopy. It was clear that the intermetallic compound was formed at the interface.