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Analysis and Optimization of Low-Power Passive Equalizers for CPU-Memory Links
  • ISSN号：2156-3950
  • 期刊名称：IEEE Transactions on Components Packaging and Manu
  • 时间：2011.9.9
  • 页码：1406-1420
  • 相关项目：面向三维芯片的互连参数提取与热分析算法研究
作者： Cheng, Chung-Kuan|Yu, Wenjian|Zhang, Yulei|Wang, Renshen|Deutsch, Alina|Katopis, George A.|Dreps, Daniel M.|Buckwalter, James|Kuh, Ernest S.|
同期刊论文项目
面向三维芯片的互连参数提取与热分析算法研究
期刊论文 15 会议论文 13 专利 4
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