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中文摘要：
针对高硅铝合金电子封装材料难加工、封焊问题,提出制备功能梯度材料.本文采用粉末冶金热压法制备出Sip/Al功能梯度材料（FGM）.相比其他工艺,热压法制备的功能梯度材料具有体积分数可调控（40％～65％Sip/Al）,压制时间短,压力小等特点.热压法制备Sip/Al功能梯度材料,通过热等静压（HIP）处理后,得到的材料密度约为2.4～2.5 g/cm3,增强体颗粒细小,各层含量分布均匀,热膨胀系数和热导率分别11.7×10-6/K,121 W·m-1·K-1,抗弯强度为228 MPa,各层硬度分别为132 HB、151 HB和170 HB.
英文摘要：
In general,the high silicon aluminum alloy electronic packaging materials are difficult to machine and seal,so functionally graded materials were proposed to prepare.In this paper,high-quality Sip/Al functionally graded materials were prepared by powder metallurgy hot pressing.Compared with the other processes,the Sip/Al functionally graded materials realized by hot pressing characterized by component controlling,short pressing time and low pressure.After hot-isostatic pressing （HIP）,the density of the Sip/Al functionally graded materials was 2.4～2.5 g/cm3 with fine Si particle size and uniform layer content.The expansion coefficient （0～400℃） was 11.7× 10 6/K,the thermal conductivity was 121 W · m-1 · K-1 and the bending strength was 228 MPa.The hardness of the layers were 132 HB、151 HB and 170 HB,respectively.
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