采用电沉积方法在黄铜基底上制备纳米结构的Ni-TiN复合薄膜。用扫描电镜(SEM)及透射电镜(TEM)对其微观结构进行表征,利用X射线衍射(XRD)分析其平均晶粒尺寸,采用极化曲线及电化学阻抗谱(EIS)研究其腐蚀行为。结果表明,电沉积的电流密度、TiN纳米粒子的浓度、搅拌速度、溶液温度及pH值对电沉积薄膜形貌的影响较大。制备的Ni-TiNi电沉积薄膜的平均晶粒尺寸约为50nm。纳米结构的Ni-TiNi电沉积薄膜的耐腐蚀性能远优于纯Ni沉积薄膜的。
The Ni-TiN nanocomposite film was successfully electrodeposited on brass copper substrates.The microstructures of the Ni-TiN nanocomposite film were investigated using scanning electron microscopy(SEM) and transmission electron microscopy(TEM).Its average grain size was analyzed through X-ray diffraction(XRD),and its anti-corrosion property was studied through potentiodynamic scanning curves and electrochemical impedance spectroscopy(EIS).The results show that the morphology of Ni-TiN composite film is sensitively dependent on the electroplating current density,TiN nanoparticle concentration,solution stirring speed,bath temperature and pH value of solution.The average grain size of the optimized nanocomposite film is about 50 nm.Meanwhile,the Ni-TiN nanocomposite films are much more resistant to corrosion than pure Ni coatings.