中文摘要：

利用Linnik显微干涉技术和环境控制技术，研制了一套环境可控的微机电系统（MEMS）微结构离面动态变形测试系统，该系统可测量不同温度、不同压力下MEMS微结构的离面动态变形情况。测试系统的环境控制装置可提供0～300℃的温度变化和0．1～0．6MPa的压力变化。利用测试系统对不同压力下绝压型硅微压力传感器膜的动态变形以及不同温度下微电路板的变形形貌进行了测量，其中绝压型硅微压力传感器膜变形量的测量重复性误差小于20nm。

英文摘要：

A measurement system for MEMS microstructures dynamic deformation with environ mental control facility was presented. The system integrated Linnik microscopic interferometry and environmental control technology,thus it was able to measure MEMS microstructures out--of--plane dynamic deformation under variable pressures and/or temperature. The environmental control facility can generate variable pressures in 0.1-0.6MPa and variable temperature in 0-300℃. The experimental work conducted on absolute pressure sensor membranes under variable pressures and micro-- printed--circuit--hoards under variable temperature confirms that such a measurement system is effective and efficient to characterize MEMS microstructures out of--plane dynamic deformation. The error of measurement repeatability for the deformation of pressure sensor membranes is less than 20nm.