中文摘要：

以紫铜为基体,采用化学镀制备了非晶态Ni-P,Ni-Sn-P镀层.采用X射线衍射（XRD）、扫描电子显微镜（SEM）和X射线能谱（EDS）等对镀层的结构、微观形貌及元素组成进行分析.通过Tafel极化曲线、电化学阻抗谱（EIS）、开路电位监测及室内加速腐蚀试验,研究两种镀层在pH=5.5,wNaCl=3.5%,以及pH=5.5,wS=20%的土壤介质中的耐蚀性能.结果表明,化学镀非晶态Ni-P及Ni-Sn-P镀层的自腐蚀电流密度是裸铜的4.5%和1.2%,两种镀层在酸性腐蚀介质中具有比金属铜更好的耐蚀性,并且化学镀Ni-Sn-P镀层耐蚀性优于Ni-P镀层.两种镀层的自腐蚀电位均负于铜.

英文摘要：

Amorphous Ni-P and Ni-Sn-P coatings were prepared on pure copper substrates by electroless plating. The structure, surface morphology and composition of the as-plated coatings were characterized by X-ray diffraction （XRD）, scanning electron microscopy （SEM） and energy-dispersive analysis （EDS）. The corrosion resistance behaviors of the as-plated Ni-P and Ni-Sn-P coatings were investigated by Tafel polarization, electrochemical impedance spectroscopy （EIS）, open circuit potential and accelerating corrosion indoors in ωNaCl =3. 5% solution at pH 5.5 and in soil with a water content of ωs=20% at pH 5. 5. The results indicate that electroless amorphous Ni-P and Ni-Sn-p plating of the corrosion current density is 4.5 % and 1.2 % of the bare copper and the two coatings offer better corrosion resistance than copper in weak acidic corrosive medium, while Ni-Sn-P coating exhibits the best corrosion resistance. Besides, thetwo coatings have a negative shift of self-corrosion potential when compared with Cu substrate, showing a good application prospect as anodic protective coatings for Cu ground wires in acidic or weak acidic soil medium.