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Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs
  • 所属机构名称：清华大学
  • 会议名称：17th IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2011
  • 成果类型：会议
  • 相关项目：三维多核片上系统的体系结构和设计研究
作者： Chen, Yibo1|Kursun, Eren2|Motschman, Dave2|Johnson, Charles2|Xie, Yuan1|
同会议论文项目
三维多核片上系统的体系结构和设计研究
期刊论文 32 会议论文 64
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