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Leveraging on-chip DRAM stacking in an embedded 3D multi-core DSP system
  • 所属机构名称：清华大学
  • 会议名称：54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011
  • 成果类型：会议
  • 相关项目：三维多核片上系统的体系结构和设计研究
作者： Zhang, Tao1|Hsu, Po-Yang2|Lo, Wei-Heng2|Tseng, Shau-Yin3|Wu, Yi-Ta3|Liu, Chuan-Nan3|Yeh, Jen-Chieh3|Hwang, Tingting2|Xie, Yuan1|
同会议论文项目
三维多核片上系统的体系结构和设计研究
期刊论文 32 会议论文 64
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