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Architecting on-chip interconnects for stacked 3D STT-RAM caches in CMPs
  • 所属机构名称：清华大学
  • 会议名称：38th Annual International Symposium on Computer Architecture, ISCA';11
  • 成果类型：会议
  • 相关项目：三维多核片上系统的体系结构和设计研究
作者： Mishra, Asit K.1|Dong, Xiangyu1|Sun, Guangyu1|Xie, Yuan1|Vijaykrishnan, N.1|Das, Chita R.1|
同会议论文项目
三维多核片上系统的体系结构和设计研究
期刊论文 32 会议论文 64
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