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Yield-aware time-efficient testing and self-fixing design for TSV-based 3D ICs
  • 所属机构名称：清华大学
  • 会议名称：17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012
  • 成果类型：会议
  • 相关项目：三维多核片上系统的体系结构和设计研究
作者： Xie, Jing1|Wang, Yu2|Xie, Yuan1|
同会议论文项目
三维多核片上系统的体系结构和设计研究
期刊论文 32 会议论文 64
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