中文摘要：

通过对芯片倒装技术尤其是凸点加工工艺在MEMS设计中的作用进行实例分析，指出倒装芯片不仅是一种高性能的封装模式，还能为MEMS器件提供立体通道或是力热载体，并形成许多特殊的结构。在MEMS的加工过程中，可以充分考虑芯片倒装技术所带来的加工便利。

英文摘要：

Several cases of MEMS devices are descried,which are using flip-chip technology as well as bump process. Flip-chip technology is no only a kind of high performance packaging,but also provides three-dimensional access ,mechanical cartier and thermal carrier for MEMS devices. It can form kinds of special construction as well. So there will be much advantage of flip-chip technology during fabrication of MEMS.