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Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining
  • ISSN号：1005-0302
  • 期刊名称：Journal of Materials Science & Technology
  • 时间：2011.11
  • 页码：1072-1076
  • 分类：TB[一般工业技术]
  • 作者机构：[1]Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences Shenyang 110016, China, [2]Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign. Urbana. IL 61801. USA
  • 相关基金：This work was supported by the National Natural Science Foundation of China （Grant No. 51171191）, the National Basic Research Program of China （Grant No. 2010CB631006） and the Natural Science Foundation of Liaoning Province, China （Grant No. 20092076）. The authors would like to thank H.Y. Guo for helpfifl discussion.
  • 相关项目：Sn基无铅焊料电迁移的各向异性研究
作者： Zhang, X. F.|Liu, H. Y.|Guo, J. D.|Shang, J. K.|
中文摘要：

Corresponding author. Prof., Ph.D.; Tel./Fax： ＋86 24 23971703; E-mail address： jkshang@imr.ac.cn

同期刊论文项目
Sn基无铅焊料电迁移的各向异性研究
期刊论文 12 会议论文 2
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期刊信息
  • 《材料科学技术学报：英文版》
  • 中国科技核心期刊
  • 主管单位:中国科协
  • 主办单位:中国金属学会
  • 主编：
  • 地址：中国沈阳文化路72号
  • 邮编：110016
  • 邮箱：
  • 电话：024-83978208
  • 国际标准刊号：ISSN：1005-0302
  • 国内统一刊号：ISSN：21-1315/TG
  • 邮发代号:
  • 获奖情况:
  • 国家“双百”期刊
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  • 被引量:474