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Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints
  • ISSN号：0021-8979
  • 期刊名称：Journal of Applied Physics
  • 时间：2013.10.21
  • 页码：-
  • 相关项目：Sn基无铅焊料电迁移的各向异性研究
作者： Chen, Jian-Qiang|Guo, Jing-Dong|Liu, Kai-Lang|Shang, Jian-Ku|
同期刊论文项目
Sn基无铅焊料电迁移的各向异性研究
期刊论文 12 会议论文 2
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