位置：成果数据库 > 期刊 > 期刊详情页
Thermal Performance of Low-Melting-Temperature Alloy Thermal Interface Materials
  • ISSN号：1006-7191
  • 期刊名称：Acta Metallurgica Sinica (English Letters)
  • 时间：2014.4
  • 页码：290-294
  • 相关项目：Sn基无铅焊料电迁移的各向异性研究
作者： Guo, Hongyan|Guo, Jingdong|Shang, Jianku|Wang, Mingguang|
同期刊论文项目
Sn基无铅焊料电迁移的各向异性研究
期刊论文 12 会议论文 2
同项目期刊论文
Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints
Electroless Deposition of Highly Solderable Fe-Ni Films
Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint
Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining
Copper Bottom-up Filling for Through Silicon Via (TSV) Using Single JGB Additive
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single cr
Phase transformation between Cu(In,Sn)(2) and Cu-2(In,Sn) compounds formed on single crystalline Cu
Reliability and failure mechanism of copper pillar joints under current stressing
Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects
Microstructure evolution in metals induced by high density electric current pulses
Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal c
期刊信息
  • 《金属学报：英文版》
  • 中国科技核心期刊
  • 主管单位:中国科协
  • 主办单位:中国金属学会
  • 主编：
  • 地址：沈阳文华路72号
  • 邮编：110016
  • 邮箱：jsxb@imr.ac.cn
  • 电话：024-23971286
  • 国际标准刊号：ISSN：1006-7191
  • 国内统一刊号：ISSN：21-1361/TG
  • 邮发代号:
  • 获奖情况:
  • 国内外数据库收录:
  • 被引量:286